Materials Science & Technology

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DC and RF Performance of Diamond MISFETs with Alumina Gate Insulator

Journal Materials Science Forum (Volumes 600 - 603)
Volume Silicon Carbide and Related Materials 2007
Edited by Akira Suzuki, Hajime Okumura, Tsunenobu Kimoto, Takashi Fuyuki, Kenji Fukuda and Shin-ichi Nishizawa
Pages 1349-1351
DOI 10.4028/www.scientific.net/MSF.600-603.1349
Citation Kazuyuki Hirama et al., 2008, Materials Science Forum, 600-603, 1349
Online since September, 2008
Authors Kazuyuki Hirama, Yoshikatsu Jingu, Masaru Ichikawa, Hitoshi Umezawa, Hiroshi Kawarada
Keywords Diamond, Gate Insulator, MISFETs, RF
Abstract

We fabricated diamond MISFETs on polycrystalline films using alumina gate insulator. A hole accumulation layer has been utilized as hole current channel. The hydrogen-termination was achieved by remote hydrogen plasma. The sheet resistance strongly depends on the substrate temperature during hydrogen-termination process. The polycrystalline diamond MISFETs showed high drain current density of -650 mA/mm and cut-off frequency of 42 GHz. These values are higher than those of single crystal diamond FETs ever reported.

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