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Investigation of Triangular Defects in 4H-SiC 4° Off Cut (0001) Si Face Epilayers Grown by CVD

Journal Materials Science Forum (Volumes 600 - 603)
Volume Silicon Carbide and Related Materials 2007
Edited by Akira Suzuki, Hajime Okumura, Tsunenobu Kimoto, Takashi Fuyuki, Kenji Fukuda and Shin-ichi Nishizawa
Pages 139-142
DOI 10.4028/www.scientific.net/MSF.600-603.139
Citation Amitesh Shrivastava et al., 2008, Materials Science Forum, 600-603, 139
Online since September, 2008
Authors Amitesh Shrivastava, Peter G. Muzykov, B. Pearman, S. Michael Angel, Tangali S. Sudarshan
Keywords 4° Off-Cut, Chemical Vapour Deposition (CVD), Inverted Pyramid, KOH Etching, RAMAN, Triangular Defects
Abstract

Triangular defects and inverted pyramid type defects formed during homoepitaxial growth on 4H-SiC Si face, 4° off-cut towards [11-20] direction have been investigated. Growth parameters responsible for triangular defect formation were identified and optimized for its reduction in this study. It was found that although the high temperature reduces the density of inverted pyramid type defects, it is not the only remedy for reducing their density and cleanliness of susceptor along with the initial growth condition plays a major role in the formation of these defects.

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