Paper Title:
New Applications in Power Electronics Based on SiC Power Devices
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 600-603)
Edited by
Akira Suzuki, Hajime Okumura, Tsunenobu Kimoto, Takashi Fuyuki, Kenji Fukuda and Shin-ichi Nishizawa
Pages
925-930
DOI
10.4028/www.scientific.net/MSF.600-603.925
Citation
H. Morel, D. Bergogne, D. Planson, B. Allard, R. Meuret, "New Applications in Power Electronics Based on SiC Power Devices", Materials Science Forum, Vols. 600-603, pp. 925-930, 2009
Online since
September 2008
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Jin Ling Song
Abstract:EXPRESS-to-XML mapping is an indispensable foundation in manufacturing network data transmission and share. Put forward and construct a...
667
Authors: Y.M. Zhou, Cheng Yong Wang, Q.Y. Yang, Y.X. Song
Abstract:Plunge milling is used to remove excessive material rapidly in roughing machining. The cutter feed in the direction of machine spindle which...
295
Authors: Jian Xiao Zou, Cui Yun Zhou, Gang Zheng
Abstract:A new variable step-size numerical algorithm for implicit integration is discussed in this paper. The scheme for increase and decrease of...
2159
Authors: Jian Dong Shang, Ya Peng Zhang, Dong Fang Hu
Chapter 14: Computer-Aided Design, Manufacturing and Engineering
Abstract:Heterogeneous data sharing is always a bottleneck problem for the development of collaborative design. The method of STEP/XML element mapping...
4103
Authors: Yusri Yusof, Nurul Zakiah Zamri Tan
Abstract:STEP-NC is used to transfer machining data between STEP-NC compliant Computer Aided Design (CAD), Computer Aided Manufacturing (CAM) and...
267