Paper Title:
Future Material Systems: Requirements and Applications
| Periodical | Materials Science Forum (Volume 608) |
|---|---|
| Main Theme | Advances in Electronic Materials |
| Edited by | Erich Kasper, Hans-Joachim Müssig and Hermann G Grimmeiss |
| Pages | 17-26 |
| DOI | 10.4028/www.scientific.net/MSF.608.17 |
| Citation | Erich Kasper et al., 2008, Materials Science Forum, 608, 17 |
| Online since | December, 2008 |
| Authors | Erich Kasper, Hans Joachim Müssig, Hermann Grimmeiss |
| Keywords | Beyond CMOS, Integrated Circuits, Lithography, Market Volume, Selforganisation, Semiconductor, System on Chip (SOC) |
| Price | US$ 28,- |
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Abstract
Requirements and applications for three different scenarios in material science of microelectronics are discussed. Dimension scaling continous at the same pace (More Moore) by changing to immersion lithography and later to extreme ultraviolet lithography. The functionality of system on chip solutions will be increased by heterogeneous technologies combined with a microelectronics core ( More than Moore). Material science and physical understanding of new device principles started well in advance to judge difficulties and options. The strong links to economy are illustrated by a simple model of exponential growth.
