Paper Title:
Future Material Systems: Requirements and Applications
  Abstract

Requirements and applications for three different scenarios in material science of microelectronics are discussed. Dimension scaling continous at the same pace (More Moore) by changing to immersion lithography and later to extreme ultraviolet lithography. The functionality of system on chip solutions will be increased by heterogeneous technologies combined with a microelectronics core ( More than Moore). Material science and physical understanding of new device principles started well in advance to judge difficulties and options. The strong links to economy are illustrated by a simple model of exponential growth.

  Info
Periodical
Edited by
Erich Kasper, Hans-Joachim Müssig and Hermann G Grimmeiss
Pages
17-26
DOI
10.4028/www.scientific.net/MSF.608.17
Citation
E. Kasper, H. J. Müssig, H. G. Grimmeiss, "Future Material Systems: Requirements and Applications", Materials Science Forum, Vol. 608, pp. 17-26, 2009
Online since
December 2008
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