Paper Title:
Wafer Level Recombination Carrier Lifetime Measurements of 4H-SiC PiN Epitaxial Wafers
  Abstract

Effective recombination lifetimes of 4H-SiC PiN epitaxy wafers are measured by -PCD (microwave photoconductive decay) system at wafer level. Lifetimes measured in presence and absence of the p+ layer show lower lifetime values with p+ layer present. This is attributed to high recombination rate at p+/n- interface. Lifetimes at various buffer thicknesses show lower values at the buffer layer of about 50 m due to high interface recombination rate resulting from rougher surface of the buffer layer. Lifetimes of PiN wafers from interrupted and continuous p+/n- growth are very comparable.

  Info
Periodical
Materials Science Forum (Volumes 615-617)
Edited by
Amador Pérez-Tomás, Philippe Godignon, Miquel Vellvehí and Pierre Brosselard
Pages
287-290
DOI
10.4028/www.scientific.net/MSF.615-617.287
Citation
G. Y. Chung, M. J. Loboda, M. F. MacMillan, J. W. Wan, "Wafer Level Recombination Carrier Lifetime Measurements of 4H-SiC PiN Epitaxial Wafers", Materials Science Forum, Vols. 615-617, pp. 287-290, 2009
Online since
March 2009
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$32.00
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