Paper Title:
AlON/SiO2 Stacked Gate Dielectrics for 4H-SiC MIS Devices
  Abstract

We propose the use of an aluminum oxynitride (AlON) gate insulator for 4H-SiC MIS devices. Since direct deposition of AlON on 4H-SiC substrate generates a large amount of interface charge due to an interfacial reaction, a thick AlON layer was deposited on underlying thin SiO2 thermally grown in N2O ambient. To reduce the negative fixed charge density in the aluminum oxide (Al2O3) film, we used reactive sputtering of Al in an N2/O2 gas mixture. The fabricated MIS capacitor with AlON/SiO2 stacked gate dielectric shows no flat band voltage shift and negligible capacitance-voltage hysteresis (30 mV), indicating the dielectric is almost free from both fixed charges and electrical defects. Owing to the high dielectric constant of AlON (k=6.9), as compared to single N2O-SiO2 gate insulator, significant gate leakage reduction was achieved by AlON/SiO2 stacked gate dielectrics even at high-temperature, especially in a high electric field condition (>5 MV/cm).

  Info
Periodical
Materials Science Forum (Volumes 615-617)
Edited by
Amador Pérez-Tomás, Philippe Godignon, Miquel Vellvehí and Pierre Brosselard
Pages
541-544
DOI
10.4028/www.scientific.net/MSF.615-617.541
Citation
T. Hosoi, M. Harada, Y. Kagei, Y. Watanabe, T. Shimura, S. Mitani, Y. Nakano, T. Nakamura, H. Watanabe, "AlON/SiO2 Stacked Gate Dielectrics for 4H-SiC MIS Devices", Materials Science Forum, Vols. 615-617, pp. 541-544, 2009
Online since
March 2009
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