Paper Title:
Residual Stress Measurement on Hetero-Epitaxial 3C-SiC Films
  Abstract

The fabrication of SiC MEMS-based sensors requires new processes able to realize microstructures on bulk material or on the SiC surface. The hetero-epitaxial growth of 3C-SiC on silicon substrates allows one to overcome the traditional limitations of SiC micro-fabrication. This approach puts together the standard silicon bulk microfabrication methodologies with the robust mechanical properties of 3C-SiC. Using this approach we were able to fabricate SiC cantilevers for a new class of pressure sensor. In the present research, chemical vapour deposition (CVD) in the low pressure regime of 3C–SiC on silicon substrates was carried out using silane (SiH4), propane (C3 H8) and hydrogen (H2) as the silicon supply, carbon supply and gas carrier, respectively. The resulting bow in the MEMS structures was evaluated optically and the residual stress in the films calculated using the modified stoney equation and determined to be approximately 300 MPa.

  Info
Periodical
Materials Science Forum (Volumes 615-617)
Edited by
Amador Pérez-Tomás, Philippe Godignon, Miquel Vellvehí and Pierre Brosselard
Pages
629-632
DOI
10.4028/www.scientific.net/MSF.615-617.629
Citation
R. Anzalone, C. Locke, A. Severino, D. Rodilosso, C. Tringali, G. Foti, S. E. Saddow, F. La Via, G. D'Arrigo, "Residual Stress Measurement on Hetero-Epitaxial 3C-SiC Films", Materials Science Forum, Vols. 615-617, pp. 629-632, 2009
Online since
March 2009
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Takeshi Kobayashi, Jiunnjye Tsaur, Masaaki Ichiki, Ryutaro Maeda
Abstract:Flat PZT cantilevers have been successfully fabricated from the Pt/Ti/PZT/Pt/Ti/SiO2/SOI multi-layered structure through MEMS technologies. A...
37
Authors: Li Wen Chen, Chia Yen Lee, Chien Hsiung Tsai, Yung Chuan Chen
Abstract:This paper studies the residual stress distributions and tip deflections of microfabricated bilayer cantilevers of varying beam thickness and...
559
Authors: Xiao Hu Zheng, Yuan Wei Liu, F. Gu, J.K. Kim, Dong Weon Lee
Abstract:A micro grooved finger has smaller bending stiffness and can be used to improve the performance of some micro cantilever devices. The...
1
Authors: Yao Min Zhu, Shan Shan Wang, Feng Zhang Ren
Other related topics
Abstract:Electroplating was employed to prepare Cu films and Ni films on Ag substrates. The average internal stresses in Cu film and Ni film were...
3085
Authors: Takahiro Kawashima, Atsushi Matsui, Kazuo Muto, Moeto Nagai, Takayuki Shibata
Chapter 5: MEMS/NEMS
Abstract:In order to detect acoustic emission (AE) signals which are transient elastic waves generated by rapid release of strain energy derived from...
575