Composition and Interface Chemistry Dependence in Ohmic Contacts to GaN HEMT Structures on the Ti/Al Ratio and Annealing Conditions |
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| Journal | Materials Science Forum (Volumes 615 - 617) |
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| Volume | Silicon Carbide and Related Materials 2008 |
| Edited by | Amador Pérez-Tomás, Philippe Godignon, Miquel Vellvehí and Pierre Brosselard |
| Pages | 951-954 |
| DOI | 10.4028/www.scientific.net/MSF.615-617.951 |
| Citation | Lilyana Kolaklieva et al., 2009, Materials Science Forum, 615-617, 951 |
| Online since | March, 2009 |
| Authors | Lilyana Kolaklieva, Roumen Kakanakov, Plamen Stefanov, Volker Cimalla, S. Maroldt, Oliver Ambacher, Katja Tonisch, Florentina Niebelschütz |
| Keywords | GaN, HEMT, Ohmic Contact, Ti-Al Composite, TLM, XPS |
| Abstract | Electrical, thermal and chemical properties of Ti/Al/Ti/Au ohmic contacts with different former Ti-Al ratio are investigated for application in GaN HEMTs. Lowest resistivity of 4.22x10-5 Ω.cm2 has been obtained to the channel of the HEMT structure. It is found out that the initial Ti/Al ratio influences the optimal annealing temperature at which the lowest resistivity is obtained and the element distribution and interface chemistry of the annealed contacts. XPS analysis revealed two compounds contributing to ohmic properties: an intermetal compound AlAu2 in the contact layer and a semimetal TiN at the interface with GaN. |
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