Paper Title:
Process Parameters Influence on Specific Contact Resistance (SCR) Value for TiAl Ohmic Contacts on GaN Grown on Sapphire
  Abstract

In this work, Ti/Al bilayer sputtered ohmic contacts on n-type Gallium Nitride films were studied as a function of process parameters such as Ti thickness, surface cleaning procedure or annealing temperature. Epilayers, with doping concentration of 5.8x1018 at.cm-3, were grown on sapphire using AlN buffer layer. Electrical characterizations were made using circular Transfer Length Method (cTLM) patterns with a four probes equipment. Specific Contact Resistance (SCR) was then extracted for all the process conditions. Our results show that surface treatment is not a critical step in the ohmic contact process while annealing temperature has a larger impact. Finally, SCR values of 1x10-5 Ω.cm2 can be reproducibly achieved, which is of high interest for future devices fabrication using this material.

  Info
Periodical
Materials Science Forum (Volumes 615-617)
Edited by
Amador Pérez-Tomás, Philippe Godignon, Miquel Vellvehí and Pierre Brosselard
Pages
955-958
DOI
10.4028/www.scientific.net/MSF.615-617.955
Citation
O. Ménard, F. Cayrel, E. Collard, D. Alquier, "Process Parameters Influence on Specific Contact Resistance (SCR) Value for TiAl Ohmic Contacts on GaN Grown on Sapphire", Materials Science Forum, Vols. 615-617, pp. 955-958, 2009
Online since
March 2009
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$32.00
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