Paper Title:
Influence of Different Interlayers Metals on Properties of Diffusion Bonding Joint of Tungsten to Copper
  Abstract

Ti foil and Ni foil interlayers were selected for the bonding of tungsten to CuCrZr alloy. The effects of bonding temperature on the microstructures and shear strength of the joints were performed. The interfacial bonding mechanism was studied through microanalysis. The results show that Ti foil was transformed into liquid solution and extruded mostly out of the bonding zone at 980°C, the strength of the joints can reach 136MPa due to the chemical and mechanical interfacial bonding. Ni foil was used for bonding of tungsten to copper alloy, the EDS analyses shows that the solid solution Ni(W) and the intermetallic compound NiW2 form in the diffusion layer at 920°C.

  Info
Periodical
Materials Science Forum (Volumes 620-622)
Edited by
Hyungsun Kim, JienFeng Yang, Tohru Sekino and Soo Wohn Lee
Pages
65-68
DOI
10.4028/www.scientific.net/MSF.620-622.65
Citation
J. Li, X. Fang, J. F. Yang, G. J. Qiao, "Influence of Different Interlayers Metals on Properties of Diffusion Bonding Joint of Tungsten to Copper", Materials Science Forum, Vols. 620-622, pp. 65-68, 2009
Online since
April 2009
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$32.00
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