Paper Title:
The Study on the Surface Abrasion about Wafer Final Polishing
  Abstract

Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafer. This study will report the evaluation on abrasion of wafer according to processing time; machining speed and pressure which have major influence on the abrasion of Si wafer polishing, for this, this study design the head unit and analysis head unit. After that, apply to experiment. It is possible to evaluation of wafer abrasion by load cell and infrared temperature sensor. The evaluation of abrasion according to processing condition is selected to use result data that measure a pressure, machining speed, and the processing time. This result is appeared by abrasion in machining condition. Through that, the study cans evaluation a wafer abrasion in machining. It is important to obtain mirror-like wafer surface.

  Info
Periodical
Materials Science Forum (Volumes 626-627)
Edited by
Dongming Guo, Jun Wang, Zhenyuan Jia, Renke Kang, Hang Gao, and Xuyue Wang
Pages
147-152
DOI
10.4028/www.scientific.net/MSF.626-627.147
Citation
J. K. Won, J. T. Lee, E. S. Lee, "The Study on the Surface Abrasion about Wafer Final Polishing", Materials Science Forum, Vols. 626-627, pp. 147-152, 2009
Online since
August 2009
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Price
$32.00
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