Paper Title:
Machining Deep Micro Holes by EDM with USM in Inversion Installing
  Abstract

In order to obtain micro holes with high aspect ratio, a new technique of machining deep micro holes by combining EDM (Electrical Discharge Machining) with USM (Ultrasonic Machining) in inversion installing is researched. The workpiece is over the electrode. The ultrasonic vibration is affixed to the electrode. The workpiece and electrode are all immersed in working liquid. The debris generated by EDM is dropped out the hole from the gap between the electrode and the hole wall by the gravity and the pumping effect of ultrasonic vibration, so as to increasing the machining velocity and machined depth. The structural features of the machining device are described, and the exploratory experiment is carried out. The corresponding process relations are found out, which can provide references for further study of this technique. The micro holes with larger than 25 in aspect ratio are machined.

  Info
Periodical
Materials Science Forum (Volumes 626-627)
Edited by
Dongming Guo, Jun Wang, Zhenyuan Jia, Renke Kang, Hang Gao, and Xuyue Wang
Pages
321-326
DOI
10.4028/www.scientific.net/MSF.626-627.321
Citation
B. X. Jia, D.S. Wang, J. Z. Guo, "Machining Deep Micro Holes by EDM with USM in Inversion Installing", Materials Science Forum, Vols. 626-627, pp. 321-326, 2009
Online since
August 2009
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Price
$32.00
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