Paper Title:
Investigation of 2-DOF Precision Positioning System for IC Packaging
  Abstract

A new 2-DOF positioning table of high speed and accuracy, directly driven by voice coil actuator, is put forward, which can be applied to IC packaging for wafer wire bonding equipment. With the help of a novel elastic decoupling mechanism, the driving element is mounted on the baseboard, diminishing its moving inertia, improving its dynamic performance. By establishing dynamic model of VCA and positioning table, an electromechanical coupling control system based on displacement PID controller is proposed. The prototype experiment shows that the new 2-DOF positioning system is of higher speed and higher accuracy than the traditional ones.

  Info
Periodical
Materials Science Forum (Volumes 628-629)
Edited by
Dongming Guo, Jun Wang, Zhenyuan Jia, Renke Kang, Hang Gao, and Xuyue Wang
Pages
363-368
DOI
10.4028/www.scientific.net/MSF.628-629.363
Citation
X. M. Feng, D. W. Zhang, L.S. Li, W.K. Liu, "Investigation of 2-DOF Precision Positioning System for IC Packaging", Materials Science Forum, Vols. 628-629, pp. 363-368, 2009
Online since
August 2009
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Price
$32.00
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