Paper Title:
Quasicontinuum Method Simulation of Nanometric Cutting of Single Crystal Copper
  Abstract

A multiscale simulation model was built to study the nanometric cutting process of single crystal copper. This multiscale model distinctly reduces the degree of freedom of the whole system compared with full atomistic simulations. Through analyzing the fluctuations of tangential cutting force and strain energy with cutting distance, we confirm that the deformation mechanism of single crystal copper is plastic deformation caused by generation and evolution dislocation. The highest compressive stress locates in shear zone and highest tensile stress locates in the machined surface and subsurface. Simulation results show that there exists a high value of stress around dislocations, which reveals the local high value of stress is the main reason for the generation and evolution of dislocations in the workpiece material.

  Info
Periodical
Materials Science Forum (Volumes 628-629)
Edited by
Dongming Guo, Jun Wang, Zhenyuan Jia, Renke Kang, Hang Gao, and Xuyue Wang
Pages
381-386
DOI
10.4028/www.scientific.net/MSF.628-629.381
Citation
Y. C. Liang, H. M. Pen, Q. S. Bai, "Quasicontinuum Method Simulation of Nanometric Cutting of Single Crystal Copper", Materials Science Forum, Vols. 628-629, pp. 381-386, 2009
Online since
August 2009
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$32.00
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