Paper Title:
Study on the Joint Strength of SiCp/ Al Metal Matrix Composite by Magnetron Sputtering Method
  Abstract

Transient liquid-phase (TLP) bonding of aluminium-based metal matrix composite (MMC) has been investigated. An attempt was made of using an Ag/Cu /Ag film as an interlayer for bonding to improve the joint strength. The oxide on the surface of SiCp/Al MMC was etched completely by plasma. Ag/Cu/Ag film of 8µm thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber. Compared with the same thickness of single Cu foil and Ni foil interlayer, which are widely used for joining SiCp/Al MMC material, the shear strength of 192.8MPa was obtained, which was 86.5% that of base metal. Discussion was made on the bonding process and microstructure.

  Info
Periodical
Materials Science Forum (Volumes 628-629)
Edited by
Dongming Guo, Jun Wang, Zhenyuan Jia, Renke Kang, Hang Gao, and Xuyue Wang
Pages
569-574
DOI
10.4028/www.scientific.net/MSF.628-629.569
Citation
R. F. Chen, Y. H. Zhao, Z. X. Shen, L. G. Dai, X. L. Zhang, R. Zhu, "Study on the Joint Strength of SiCp/ Al Metal Matrix Composite by Magnetron Sputtering Method", Materials Science Forum, Vols. 628-629, pp. 569-574, 2009
Online since
August 2009
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Price
$32.00
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