Paper Title:
Ductility of Thin Metallic Films
  Abstract

Depending on the loading conditions, geometry and material characteristics, the ductility of thin metallic films is controlled either by the resistance to plastic localization or by the resistance to internal damage. New on-chip tensile tests performed on submicron aluminium films show significant strain hardening capacity leading to relatively good resistance to necking, while damage occurs through void nucleation at grain boundaries followed by their growth and coalescence. These results are discussed in the light of several other studies presented in the recent literature in order to unravel the origins of the frequently reported poor ductility of thin metallic films, and the various means existing to improve it.

  Info
Periodical
Materials Science Forum (Volumes 633-634)
Edited by
Yonghao Zhao and Xiaozhou Liao
Pages
615-635
DOI
10.4028/www.scientific.net/MSF.633-634.615
Citation
T. Pardoen, M. Coulombier, A. Boe, A. Safi, C. Brugger, S. Ryelandt, P. Carbonnelle, S. Gravier, J. P. Raskin, "Ductility of Thin Metallic Films", Materials Science Forum, Vols. 633-634, pp. 615-635, 2010
Online since
November 2009
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Price
$32.00
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