Paper Title:
In Situ Transmission Electron Microscopy Investigation of the Deformation Behavior of Cu with Nanoscale Twins
  Abstract

This paper reviews our recent studies on the effect of twin boundary (TB) on the deformation behavior in Cu with nanoscale growth twins. In situ straining transmission electron microscopy investigations on TB migration, TBs and twin ends acting as dislocation emission sources, and the interactions between dislocations and TBs are highlighted. Results provide some useful understanding of why Cu with nanoscale twins leads to a combination of ultrahigh strength and high ductility.

  Info
Periodical
Materials Science Forum (Volumes 633-634)
Edited by
Yonghao Zhao and Xiaozhou Liao
Pages
63-72
DOI
10.4028/www.scientific.net/MSF.633-634.63
Citation
Y. B. Wang, M.L. Sui, "In Situ Transmission Electron Microscopy Investigation of the Deformation Behavior of Cu with Nanoscale Twins", Materials Science Forum, Vols. 633-634, pp. 63-72, 2010
Online since
November 2009
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