In Situ Transmission Electron Microscopy Investigation of the Deformation Behavior of Cu with Nanoscale Twins |
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| Journal | Materials Science Forum (Volumes 633 - 634) |
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| Volume | Ductility of Bulk Nanostructured Materials |
| Edited by | Yonghao Zhao and Xiaozhou Liao |
| Pages | 63-72 |
| DOI | 10.4028/www.scientific.net/MSF.633-634.63 |
| Citation | Y. B. Wang et al., 2009, Materials Science Forum, 633-634, 63 |
| Online since | November, 2009 |
| Authors | Y. B. Wang, M.L. Sui |
| Keywords | In Situ Transmission Electron Microscopy, Deformation, Nanostructured Copper, Twin |
| Abstract | This paper reviews our recent studies on the effect of twin boundary (TB) on the deformation behavior in Cu with nanoscale growth twins. In situ straining transmission electron microscopy investigations on TB migration, TBs and twin ends acting as dislocation emission sources, and the interactions between dislocations and TBs are highlighted. Results provide some useful understanding of why Cu with nanoscale twins leads to a combination of ultrahigh strength and high ductility. |
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