Paper Title:
Al/Ni Self-Propagating Exothermic Film for MEMS Application
  Abstract

This paper describes evaluation of the strength in Ag-Sn-jointed Si specimens heated by Al/Ni film’s exothermic reaction. The reaction generates heat enough to melt Ag-Sn film for soldering. To measure the strength, four-point micro-bending test technique has been developed. The rectangular-solid Si specimens having a Ag-Sn/AlNi/Ag-Sn section were prepared by dicing the bonded Si-wafer under various pressure loads. A higher pressure yielded a better contact condition between Al/Ni and Ag-Sn so that heat-conduction improved; consequently Ag-Sn was melted sufficiently. Al/Ni reactive film has a potential as a micro-heater in soldering for MEMS.

  Info
Periodical
Materials Science Forum (Volumes 638-642)
Main Theme
Edited by
T. Chandra, N. Wanderka, W. Reimers , M. Ionescu
Pages
2142-2147
DOI
10.4028/www.scientific.net/MSF.638-642.2142
Citation
T. Namazu, S. Inoue, "Al/Ni Self-Propagating Exothermic Film for MEMS Application", Materials Science Forum, Vols. 638-642, pp. 2142-2147, 2010
Online since
January 2010
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Price
$32.00
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