Paper Title:
Action of Displacement Control on Vacuum Free Aluminum/Copper Diffusion Liquefaction Bonding
  Abstract

Quickness of fracture of Al oxide film is important especially for vacuum free Al/Cu bonding. Displacement amount and rate relate closely with fracture of oxide film and create clean surface. Displacement history during bonding process under static bonding load was measured for displacement control systematically. Displacement history under static load consists of three stages with creep and liquefaction. Higher bonding load increased displacement rate of each stage and decreased the thickness of Al oxide film grown by air heating. Suitable hearing time for bond also was shortened by increment of bonding load. Two types of displacement control were designed from these experimental results. One was the accelerated displacement rate control, another was the cyclic displacement control. Fracture of Al oxide film and liquefaction of bonding surface occurred at lower displacement than static load by each displacement control.

  Info
Periodical
Materials Science Forum (Volumes 638-642)
Main Theme
Edited by
T. Chandra, N. Wanderka, W. Reimers , M. Ionescu
Pages
3297-3301
DOI
10.4028/www.scientific.net/MSF.638-642.3297
Citation
H. Kawakami, T. Kawabe, J. Suzuki, "Action of Displacement Control on Vacuum Free Aluminum/Copper Diffusion Liquefaction Bonding", Materials Science Forum, Vols. 638-642, pp. 3297-3301, 2010
Online since
January 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Yasushi Fukuzawa, Shigeru Nagasawa, Masahiro Watanabe, Shigehiko Takaoka
Abstract:To develop the new bonding method under low bonding temperature and short holding duration, pulse electric current sintering (PECS) method is...
443
Authors: Kyung Hoon Kim, Sung Chul Lim, Hyouk Chon Kwon
Abstract:Surface activated bonding (SAB) is a novel method for the precise joining of dissimilar materials. It is based on the concept that two...
1932
Authors: Tashiyuki Torii, Koki Ishida, Mohamed K Hassan, Kenichi Shimizu
Abstract:Laminated copper films of the epoxy-bonded or diffusion-bonded to the base metal were used in order to investigate and analyze film fatigue...
253
Authors: Bo Shan, Jie Chen, Yan Xiao
Bamboo Materials
Abstract:Glubam is a kind of environmentally friendly and energy efficient composite material in civil engineering developed in recent years. But the...
43
Authors: Yao Chu, Shi Hang Jiang, Wei Jian Fan, Zhao Yang Jin, Du Xiong Wang
Chapter 1: Materials Engineering. Technologies and Processing
Abstract:Transient liquid-phase(TLP) bonding of SiC particle reinforced aluminum matrix composite(SiCp/Al MMCs) ,using Cu film, Cu foil, Ni foil and...
44