Paper Title:
Microstructure of Bonding Interface in Explosively Welded Metal/Ceramic Clad
  Abstract

Bonding interface in aluminum (Al) and silicon nitride (Si3N4) clad fabricated by explosive welding has been investigated by transmission electron microscopy (TEM). The nanocrystalline region was clearly observed at the interface between Al and Si3N4. Electron diffraction pattern and energy dispersive X-ray spectroscopy (EDS) measurements across the interface revealed that this nanocrystalline region consist of the only aluminum.

  Info
Periodical
Materials Science Forum (Volumes 638-642)
Main Theme
Edited by
T. Chandra, N. Wanderka, W. Reimers , M. Ionescu
Pages
3775-3780
DOI
10.4028/www.scientific.net/MSF.638-642.3775
Citation
S. Ii, C. Iwamoto, S. Satonaka, K. Hokamoto, M. Fujita, "Microstructure of Bonding Interface in Explosively Welded Metal/Ceramic Clad", Materials Science Forum, Vols. 638-642, pp. 3775-3780, 2010
Online since
January 2010
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