Paper Title:
Alumina-Copper Composites with High Fracture Toughness and Low Electrical Resistance
  Abstract

Through an intense mixing process of Al2O3 powder with different copper contents, Al2O3-Cu composites were fabricated by sintered at 1300°C during 1h, where the likely liquid sintering mechanism, lead to obtain composites with relative densities greater than 95%. Scanning electron microscopy was used to observe the resulting microstructures, which indicated that these composites were mostly formed by a fine and homogeneous Al2O3-ceramic matrix with immerse nano-metallic copper particles. The behavior of both fracture toughness and electrical resistance of the composites is directly dependent with the copper content in the matrix. As the copper contents increased, the composites exhibited high values of fracture toughness, whereas, their electrical resistance is reduced considerably.

  Info
Periodical
Edited by
Arturo Ponce and Darío Bueno
Pages
43-46
DOI
10.4028/www.scientific.net/MSF.644.43
Citation
E. Rocha-Rangel, J. G. Miranda-Hernández, "Alumina-Copper Composites with High Fracture Toughness and Low Electrical Resistance ", Materials Science Forum, Vol. 644, pp. 43-46, 2010
Online since
March 2010
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$32.00
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