Paper Title:
Improved Electrical Properties of SiC-MOS Interfaces by Thermal Oxidation of Plasma Nitrided 4H-SiC(0001) Surfaces
  Abstract

We propose a treatment of nitrogen radical irradiation to 4H-SiC surfaces for improving thermally grown SiO2/SiC interfaces. X-ray photoelectron spectroscopy (XPS) analyses revealed that a 1.7-nm-thick nitride film was formed by nitrogen radical exposure for 30 min and that Si-N bonds were retained after subsequent 10 min oxidation. It was also confirmed by secondary ion mass spectrometry (SIMS) that nitrogen atoms were piled up at the SiO2/SiC interface for the samples fabricated by thermal oxidation for 3 min with nitrogen plasma exposure. The metal-oxide-semiconductor (MOS) capacitors with a thin oxynitride layer formed by nitrogen radical exposure to the SiC surface and subsequent thermal oxidation exhibited excellent capacitance-voltage (C-V) characteristics. The interface state density (Dit) was significantly reduced by nitrogen radical exposure even at the shallow energy level near the conduction band edge. A minimum Dit value of 1.4 × 1011 cm-2eV-1 at Ec – E = 0.44 eV was achieved. Therefore, we can conclude that the treatment of nitrogen radical irradiation to the SiC surface prior to thermal oxidation is a promising method for improving SiC-MOS characteristics.

  Info
Periodical
Materials Science Forum (Volumes 645-648)
Edited by
Anton J. Bauer, Peter Friedrichs, Michael Krieger, Gerhard Pensl, Roland Rupp and Thomas Seyller
Pages
507-510
DOI
10.4028/www.scientific.net/MSF.645-648.507
Citation
Y. Kagei, T. Kirino, Y. Watanabe, S. Mitani, Y. Nakano, T. Nakamura, T. Hosoi, T. Shimura, H. Watanabe, "Improved Electrical Properties of SiC-MOS Interfaces by Thermal Oxidation of Plasma Nitrided 4H-SiC(0001) Surfaces", Materials Science Forum, Vols. 645-648, pp. 507-510, 2010
Online since
April 2010
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Price
$35.00
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