Paper Title:
Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints
  Abstract

The effects of Ni on the properties of the Sn-2.5Ag-0.7Cu-0.1Re solder alloy and its creep properties of solder joints are researched. The results show that with adding 0.05wt% Ni in the Sn-2.5Ag-0.7Cu-0.1Re solder alloy, the elongation can be sharply improved without decreasing its tensile strength and it is 1.4 times higher than that of the commercial Sn-3.8Ag-0.7Cu solder alloy. Accordingly the creep rupture life of Sn-2.5Ag-0.7Cu-0.1Re-0.05Ni solder joints is the longest, which is 13.3 times longer than that of Sn-2.5Ag-0.7Cu-0.1Re and is also longer than that of the commercial Sn-3.8Ag-0.7Cu solder alloy. In the same environmental conditions, the creep rupture life of Sn-2.5Ag-0.7Cu-0.1Re-0.05Ni solder joints can sharply decrease with increasing the temperature and stress.

  Info
Periodical
Edited by
Yafang Han, Tianmin Wang and Shaoxiong Zhou
Pages
91-96
DOI
10.4028/www.scientific.net/MSF.650.91
Citation
K. K. Zhang, Y. L. Wang, Y. L. Fan, G. J. Zhao, Y. F. Yan, X. Zhang, "Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints", Materials Science Forum, Vol. 650, pp. 91-96, 2010
Online since
May 2010
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$32.00
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