Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints |
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| Journal | Materials Science Forum (Volume 650) |
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| Volume | Energy and Environment Materials |
| Edited by | Yafang Han, Tianmin Wang and Shaoxiong Zhou |
| Pages | 91-96 |
| DOI | 10.4028/www.scientific.net/MSF.650.91 |
| Citation | Ke Ke Zhang et al., 2010, Materials Science Forum, 650, 91 |
| Online since | May, 2010 |
| Authors | Ke Ke Zhang, Yao Li Wang, Yan Li Fan, Guo Ji Zhao, Yan Fu Yan, Xin Zhang |
| Keywords | Creep Rupture Life, Elongation, Sn-2.5Ag-0.7Cu-0.1RE-XNi Lead Free Solder, Solder Joint, Tensile Strength |
| Abstract | The effects of Ni on the properties of the Sn-2.5Ag-0.7Cu-0.1Re solder alloy and its creep properties of solder joints are researched. The results show that with adding 0.05wt% Ni in the Sn-2.5Ag-0.7Cu-0.1Re solder alloy, the elongation can be sharply improved without decreasing its tensile strength and it is 1.4 times higher than that of the commercial Sn-3.8Ag-0.7Cu solder alloy. Accordingly the creep rupture life of Sn-2.5Ag-0.7Cu-0.1Re-0.05Ni solder joints is the longest, which is 13.3 times longer than that of Sn-2.5Ag-0.7Cu-0.1Re and is also longer than that of the commercial Sn-3.8Ag-0.7Cu solder alloy. In the same environmental conditions, the creep rupture life of Sn-2.5Ag-0.7Cu-0.1Re-0.05Ni solder joints can sharply decrease with increasing the temperature and stress. |
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