Paper Title:
Mechanisms of Dynamic Recrystallization in Cu-Sn-P Alloy
  Abstract

Dynamic recrystallization (DRX) behavior in a Cu-0.65Sn-0.025P (mass%) alloy (Cu-Sn-P), which had been newly developed for high strength copper tubes, was systematically investigated. For this purpose, an orientation-controlled bicrystal ( =28o); a model samples of the as-casted billet having coarse columnar grains, was hot deformed in compression at 1073 K at true strain rates from 2 x 10-3 s-1 to 2 x 10-1 s-1 in vacuum. Appearance of peak stress, where DRX sets in, was much delayed in Cu-Sn-P alloy compared with that in Cu and the other copper alloys. While nucleation of new grains preferentially took place at grain boundary, this tendency became more significant with decreasing strain rate. Almost all the new grains were annealing twins (3) formed behind the migrating grain boundary. The more preferential nucleation at grain boundary with decreasing strain rate could be, therefore, reasonably understood by easier and more extensive occurrence of grain boundary migration at lower strain rate.

  Info
Periodical
Materials Science Forum (Volumes 654-656)
Main Theme
Edited by
Jian-Feng Nie and Allan Morton
Pages
1267-1270
DOI
10.4028/www.scientific.net/MSF.654-656.1267
Citation
H. Miura, M. Watanabe, T. Shirai, A. Ishibashi, "Mechanisms of Dynamic Recrystallization in Cu-Sn-P Alloy", Materials Science Forum, Vols. 654-656, pp. 1267-1270, 2010
Online since
June 2010
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