Paper Title:
Dynamic Recrystallization Behaviour in Cu-Sn-P Alloy for High Strength Copper Tube
  Abstract

Dynamic recrystallization (DRX) behaviour in a newly developed Cu-Sn-P alloy for heat exchangers and tubes was systematically investigated. For this purpose, Cu-Sn-P alloys with different content of Sn were deformed in compression at temperatures between 1073 K and 1213 K and at various strain rates from 2 x 10-4 s-1 to 2 x 10-1 s-1. The onset of DRX was more advanced with increasing temperature and with decreasing strain rate. Full DRX was not achieved at the testing conditions of lower temperature and higher strain rate even after straining to ε = 1.0. This tendency was more significant in the alloy with higher Sn content. With increasing Sn content, the flow stress and the obtained grains size became higher and finer, respectively. These experimental results indicate the important role of Sn for strengthening and microstructual control.

  Info
Periodical
Materials Science Forum (Volumes 654-656)
Main Theme
Edited by
Jian-Feng Nie and Allan Morton
Pages
1271-1274
DOI
10.4028/www.scientific.net/MSF.654-656.1271
Citation
M. Watanabe, T. Shirai, A. Ishibashi, H. Miura, "Dynamic Recrystallization Behaviour in Cu-Sn-P Alloy for High Strength Copper Tube", Materials Science Forum, Vols. 654-656, pp. 1271-1274, 2010
Online since
June 2010
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