Paper Title:
Investigation on Interfacial Bonding Strength of Anisotropic Conducive Adhesive with a New Cohesive Zone Model
  Abstract

A modified cohesive zone interface model with a damage factor was proposed to describe the effects of the thermal cycle and humidity aging on the strengths of adhesive joints. The damage factor can not only change the cohesive zone bonding strength but also affect the energies of separation. The modified cohesive zone interfacial model, as a user subroutine, is developed and implemented in ABAQUS to simulate the 90° peeling process of the specimens, which were bonded by anisotropic conducive adhesive film (ACF) and subjected to the cycle and humidity aging tests. The numerical simulated results well agree with experimental results, which confirmed the validity of the new model.

  Info
Periodical
Materials Science Forum (Volumes 654-656)
Main Theme
Edited by
Jian-Feng Nie and Allan Morton
Pages
1928-1931
DOI
10.4028/www.scientific.net/MSF.654-656.1928
Citation
J. Zhang, Y. C. Lin, X. L. Wei, L. G. Huang, "Investigation on Interfacial Bonding Strength of Anisotropic Conducive Adhesive with a New Cohesive Zone Model", Materials Science Forum, Vols. 654-656, pp. 1928-1931, 2010
Online since
June 2010
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Price
$32.00
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