Paper Title:
Defect and Damage Evolution Quantification in Dynamically-Deformed Metals Using Orientation-Imaging Microscopy
  Abstract

Orientation-imaging microscopy offers unique capabilities to quantify the defects and damage evolution occurring in metals following dynamic and shock loading. Examples of the quantification of the types of deformation twins activated, volume fraction of twinning, and damage evolution as a function of shock loading in Ta are presented. Electron back-scatter diffraction (EBSD) examination of the damage evolution in sweeping-detonation-wave shock loading to study spallation in Cu is also presented.

  Info
Periodical
Materials Science Forum (Volumes 654-656)
Main Theme
Edited by
Jian-Feng Nie and Allan Morton
Pages
2297-2302
DOI
10.4028/www.scientific.net/MSF.654-656.2297
Citation
G. T. Gray III, V. Livescu, E. K. Cerreta, "Defect and Damage Evolution Quantification in Dynamically-Deformed Metals Using Orientation-Imaging Microscopy", Materials Science Forum, Vols. 654-656, pp. 2297-2302, 2010
Online since
June 2010
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