Paper Title:
Formation and Mechanical Properties of Intermetallic Compounds in Sn-Cu High-Temperature Lead-Free Solder Joints
  Abstract

High-temperature lead-free solders are important materials for electrical and electronic devices due to increasing legislative requirements that aim at reducing the use of traditional lead-based solders. For the successful use of lead-free solders, a comprehensive understanding of the formation and mechanical properties of Intermetallic Compounds (IMCs) that form in the vicinity of the solder-substrate interface is essential. In this work, the effect of nickel addition on the formation and mechanical properties of Cu6Sn5 IMCs in Sn-Cu high-temperature lead-free solder joints was investigated using Scanning Electron Microscopy (SEM) and nanoindentation. It was found that the nickel addition increased the elastic modulus and hardness of the (Cu, Ni)6Sn5. The relationship between the nickel content and the mechanical properties of the IMCs was also established.

  Info
Periodical
Materials Science Forum (Volumes 654-656)
Main Theme
Edited by
Jian-Feng Nie and Allan Morton
Pages
2450-2454
DOI
10.4028/www.scientific.net/MSF.654-656.2450
Citation
D. Mu, H. Tsukamoto, H. Huang, K. Nogita, "Formation and Mechanical Properties of Intermetallic Compounds in Sn-Cu High-Temperature Lead-Free Solder Joints", Materials Science Forum, Vols. 654-656, pp. 2450-2454, 2010
Online since
June 2010
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Price
$32.00
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