Effects of Deformation-Induced Heating on Bond Strength of Rolled Metal Multilayer
|Periodical||Materials Science Forum (Volumes 654 - 656)|
|Edited by||Jian-Feng Nie and Allan Morton|
|Citation||Deng Ke Yang et al., 2010, Materials Science Forum, 654-656, 2579|
|Online since||June 2010|
|Authors||Deng Ke Yang, Peter D. Hodgson, Cui'e Wen|
|Keywords||Bond Strength, Oxide Film, Roll Bonding, Thermal Conductivity (TC)|
The bond strength of various metal multilayers produced by cold rolling of metal foils with different thermal conductivity was investigated. Results indicated that under the same conditions of deformation and surface preparation, the metallic multilayer system with low thermal conductivity exhibited relative high bond strength while high thermal conductivity metal system may fail to be roll-bonded together. The relationship between the deformation-induced localized heating and the bond strength were discussed. The deformation-induced localized heating in the low thermal conductivity metal multilayer systems may provide opportunities for achieving a successful accumulative roll bonding or a “cold roll/heat treatment/cold roll” process to synthesize metallic multilayer materials.