Paper Title:
Effects of Deformation-Induced Heating on Bond Strength of Rolled Metal Multilayer
  Abstract

The bond strength of various metal multilayers produced by cold rolling of metal foils with different thermal conductivity was investigated. Results indicated that under the same conditions of deformation and surface preparation, the metallic multilayer system with low thermal conductivity exhibited relative high bond strength while high thermal conductivity metal system may fail to be roll-bonded together. The relationship between the deformation-induced localized heating and the bond strength were discussed. The deformation-induced localized heating in the low thermal conductivity metal multilayer systems may provide opportunities for achieving a successful accumulative roll bonding or a “cold roll/heat treatment/cold roll” process to synthesize metallic multilayer materials.

  Info
Periodical
Materials Science Forum (Volumes 654-656)
Main Theme
Edited by
Jian-Feng Nie and Allan Morton
Pages
2579-2582
DOI
10.4028/www.scientific.net/MSF.654-656.2579
Citation
D. K. Yang, P. D. Hodgson, C.'e Wen, "Effects of Deformation-Induced Heating on Bond Strength of Rolled Metal Multilayer", Materials Science Forum, Vols. 654-656, pp. 2579-2582, Jun. 2010
Online since
June 2010
Price
US$ 28,-
Share
Authors: K. Rajanna, S. Tanaka, Toshio Itoh, Masayoshi Esashi
1527
Authors: Min Yang, Zeng Da Zou, Si Li Song, Xin Hong Wang
Abstract:In this study, Si3N4 was bonded to Inconel600 with Nb/Cu/Ni interlayer by partial liquid phase diffusion bonding method under vacuum...
2435
Authors: Akio Nishimoto, Katsuya Akamatsu
Abstract:Pulsed electric current sintering (PECS) was applied to the bonding of W (tungsten) to Cu (copper) using Nb or Ni powder as an intermediate...
289
Authors: Kyung Hoon Kim, Sung Chul Lim, Hyouk Chon Kwon
Abstract:Surface activated bonding (SAB) is a novel method for the precise joining of dissimilar materials. It is based on the concept that two...
1932
Authors: Yao Chu, Shi Hang Jiang, Wei Jian Fan, Zhao Yang Jin, Du Xiong Wang
Chapter 1: Materials Engineering. Technologies and Processing
Abstract:Transient liquid-phase(TLP) bonding of SiC particle reinforced aluminum matrix composite(SiCp/Al MMCs) ,using Cu film, Cu foil, Ni foil and...
44