Paper Title:

Impact Study of Substrate Materials on Wireless Sensor Node RF Performance

Periodical Materials Science Forum (Volumes 663 - 665)
Main Theme Optoelectronic Materials
Edited by Yuan Ming Huang
Pages 455-461
DOI 10.4028/www.scientific.net/MSF.663-665.455
Citation Li Qiang Zheng et al., 2010, Materials Science Forum, 663-665, 455
Online since November 2010
Authors Li Qiang Zheng, Alan Mathewson, Brendan O'Flynn, Michael Hayes, Cian O'Mathuna
Keywords Optimization, Return Loss, RF Circuit Modeling, Substrate Impact
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In this paper, the effect of the substrate on wireless sensor network (WSN) node’s RF performance is studied experimentally by using different substrate materials with different thickness. A six-layer FR4 substrate PCB WSN node is fabricated and compared with the original two-layer FR4 PCB node to show the impact of substrate material thickness. Also different substrate dielectric constants’ impacts are studied by the same method. All these demonstrators are modeling by RF circuit analysis method and simulated in the Ansoft Designer software. Simulation results match the experimental measurement. An optimization method based on simulation for WSN node design with different substrate is presented. This analysis, modeling, simulation and optimization procedure can be carried out on some novel substrate materials such as LTCC and LCP.