Paper Title:
Aging Behavior of Cu-Ni-Si Alloy Processed by High-Pressure Torsion
  Abstract

An age-hardenable Cu-2.9%Ni-0.6%Si alloy was subjected to high-pressure torsion. Aging behavior was investigated in terms of hardness, electrical conductivity and microstructural features. Transmission electron microscopy showed that the grain size is refined to ~150 nm and the Vickers microhardness was significantly increased through the HPT process. Aging treatment of the HPT-processed alloy led to a further increase in the hardness. Electrical conductivity is also improved with the aging treatment. It was confirmed that the simultaneous strengthening by grain refinement and fine precipitation is achieved while maintaining high electrical conductivity. Three dimensional atom probe analysis revealed that fine precipitates with sizes of ~20 nm or smaller were formed in the Cu matrix and some particles consist of Ni and Si with no appreciable amount of Cu.

  Info
Periodical
Materials Science Forum (Volumes 667-669)
Edited by
Jing Tao Wang, Roberto B. Figueiredo and Terence G. Langdon
Pages
307-312
DOI
10.4028/www.scientific.net/MSF.667-669.307
Citation
H. Matsunaga, Z. Horita, K. Imamura, T. Kiss, X. Sauvage, "Aging Behavior of Cu-Ni-Si Alloy Processed by High-Pressure Torsion", Materials Science Forum, Vols. 667-669, pp. 307-312, 2011
Online since
December 2010
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Price
$35.00
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