Paper Title:
Viscosity of Sn-Cu Solders Investigated by Molecular Dynamics
  Abstract

The self-diffusion coefficient of Cu in Sn-1.5wt.%Cu and Sn-2wt.%Cu lead-free solders was investigated using molecular dynamics simulations based on a modified embedded-atom method from 503 K to 773 K. Then the viscosity of the solders was calculated using the selfdiffusion coefficient values, and the results were in good agreement with the experimental data. Two segments, a low-temperature zone and a high-temperature zone, were found on both η–T and lnη–1/T plots, where η is the viscosity and T is the absolute temperature. Through analysis, we infer that the viscosity mutation was attributed to the remarkable structure transition.

  Info
Periodical
Materials Science Forum (Volumes 675-677)
Edited by
Yi Tan and Dongying Ju
Pages
1011-1014
DOI
10.4028/www.scientific.net/MSF.675-677.1011
Citation
R. F. Ding, X. M. Pan, G. L. Wei, "Viscosity of Sn-Cu Solders Investigated by Molecular Dynamics", Materials Science Forum, Vols. 675-677, pp. 1011-1014, 2011
Online since
February 2011
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Price
$32.00
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