Paper Title:
Effects of Strain Rate on the Tensile Deformation of Single-Crystal Copper Films
  Abstract

Molecular dynamics (MD) simulations with an EAM potential are carried out to study the strain rate effects on the tensile deformation of single-crystal copper films. The stress, the atomic energy, as well as the atomic configurations of the systems are presented to explore the strain rate effects on copper films. It is found that yield stress increases with loading rate. Meanwhile, deformation mechanisms with different strain rates are analyzed in the present work. At lower strain rate, slips along {111} planes are primarily responsible for the plastic deformation in nano-Cu films. As strain rate increased, the motion of dislocations becomes easier, a transition of the deformation mechanism from sequential propagation of slips along well-defined slip planes to complex cross-slip.

  Info
Periodical
Materials Science Forum (Volumes 675-677)
Edited by
Yi Tan and Dongying Ju
Pages
671-673
DOI
10.4028/www.scientific.net/MSF.675-677.671
Citation
S. Xu, Y. F. Guo, "Effects of Strain Rate on the Tensile Deformation of Single-Crystal Copper Films", Materials Science Forum, Vols. 675-677, pp. 671-673, 2011
Online since
February 2011
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Price
$32.00
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