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Thin Film Stress and Texture Analysis at the MCX Synchrotron Radiation Beamline at ELETTRA

Journal Materials Science Forum (Volume 681)
Volume Residual Stresses VIII
Edited by Paolo Scardi and Cristy L. Azanza Ricardo
Pages 115-120
DOI 10.4028/www.scientific.net/MSF.681.115
Citation Matteo Ortolani et al., 2011, Materials Science Forum, 681, 115
Online since March, 2011
Authors Matteo Ortolani, Cristy Leonor Azanza Ricardo, Andrea Lausi, Paolo Scardi
Keywords Synchrotron Radiation, Texture Analysis, Thin Film, X-Ray Diffraction (XRD)
Abstract

The main instrumental characteristics of MCX, the new beamline at the Italian synchrotron Elettra in Trieste, are presented. Design and geometrical set-up are well suited to the X-ray diffraction stress and texture analysis of thin films and surfaces, and are such to guarantee a full control of the main instrumental errors. Besides exploiting the typical features of synchrotron radiation, like high brilliance, tuneable beam energy and optimal beam geometry, MCX can also host tools for in-situ studies, like X-ray diffraction during four point bending. A few examples of current applications are shown.

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