Paper Title:
Thin Film Stress and Texture Analysis at the MCX Synchrotron Radiation Beamline at ELETTRA
  Abstract

The main instrumental characteristics of MCX, the new beamline at the Italian synchrotron Elettra in Trieste, are presented. Design and geometrical set-up are well suited to the X-ray diffraction stress and texture analysis of thin films and surfaces, and are such to guarantee a full control of the main instrumental errors. Besides exploiting the typical features of synchrotron radiation, like high brilliance, tuneable beam energy and optimal beam geometry, MCX can also host tools for in-situ studies, like X-ray diffraction during four point bending. A few examples of current applications are shown.

  Info
Periodical
Edited by
Paolo Scardi and Cristy L. Azanza Ricardo
Pages
115-120
DOI
10.4028/www.scientific.net/MSF.681.115
Citation
M. Ortolani, C. L. Azanza Ricardo, A. Lausi, P. Scardi, "Thin Film Stress and Texture Analysis at the MCX Synchrotron Radiation Beamline at ELETTRA", Materials Science Forum, Vol. 681, pp. 115-120, 2011
Online since
March 2011
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