The system components and the theory of jet electrodeposition orientated by rapid prototyping (RP) are introduced.The nanocrystalline copper parts with simple shape were fabricated by RP technology. The microstructure evolution of the nanocrystalline Copper layer was examined by means of the Scanning Electron Microscopy (SEM) and X-ray Diffraction (XRD). The results show that the jet electrodeposition can greatly enhance the limited current density, fine crystalline particles and improve deposition quality. The copper deposited layers have nanocrystalline microstructure with average size of 55.6nm. The grain size decreases to 41.4 nm in crystal plane (311).