A Comparison of Temperature-Dependent Compressive Deformation Features of Ultrafine-Grained Ti and Cu Produced by ECAP

The temperature-dependent deformation and damage behaviors of ultrafine-grained (UFG) Cu and Ti produced by equal channel angular pressing (ECAP) were investigated and compared. It was found that ECAPed materials with different crystalline structures, e.g. the present fcc Cu and hcp Ti, exhibited significantly distinctive high-temperature deformation and damage characteristics. As the testing temperature is below recrystallization, small- and large-scale cracks or voids formed along the shear bands (SBs) on the surface of UFG Cu, whereas only a few fine shear lines and some non-propagation voids appeared on the surface of UFG Ti. As the temperature is above recrystallization, some small cracks (or voids) formed along grain boundaries and slip deformation took place in many coarsened grains, while only extrusions and intrusions instead of obvious cracks or voids are observable for UFG Ti. The corresponding microstructual changes after compressive deformation, e.g. grain coarsening, were also examined and confirmed by TEM observations.