Paper Title:
Microstructure and Thermo-Physical Properties of TiB2/Si-30Al Composite for Electronic Packaging Applications
  Abstract

2wt.%TiB2/Si-30Al composite was prepared by in-situ reaction and spray forming first and then by hot isostatic pressing (HIP). The microstructure and thermo-physical properties of the composite were investigated by means of scanning electron microscopy, and thermal expansion analyzer respectively. The results show that the microstructure of the TiB2/Si-30Al composite consists of a continuous network of primary Si (~35μm), interpenetrating secondary Al phase, and fine TiB2 particles (1~2μm). The TiB2 particles were uniformly distributed in the Si-30Al alloy matrix. After HIP, the pores in the TiB2/Si-30Al composite were almost eliminated, and the relative density of the composite was up to 98.9%. The 2wt.%TiB2/Si-30Al composite after the HIP exhibits good thermo-physical properties, including lower coefficient of thermal expansion (CTE) (6.6´10-6×K-1) and higher thermal conductivity (84 W×m-1×K-1).

  Info
Periodical
Edited by
Chengming Li, Chengbao Jiang, Zhiyong Zhong and Yichun Zhou
Pages
138-143
DOI
10.4028/www.scientific.net/MSF.687.138
Citation
G. S. Gan, L. Zhang, Y. Lu, B. Yang, "Microstructure and Thermo-Physical Properties of TiB2/Si-30Al Composite for Electronic Packaging Applications", Materials Science Forum, Vol. 687, pp. 138-143, 2011
Online since
June 2011
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$32.00
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