Paper Title:
Effect of RE on Creep Rupture Life of SnAgCu Solder Joints
| Periodical | Materials Science Forum (Volume 687) |
|---|---|
| Main Theme | Functional and Electronic Materials |
| Edited by | Chengming Li, Chengbao Jiang, Zhiyong Zhong and Yichun Zhou |
| Pages | 39-43 |
| DOI | 10.4028/www.scientific.net/MSF.687.39 |
| Citation | Yao Li Wang et al., 2011, Materials Science Forum, 687, 39 |
| Online since | June, 2011 |
| Authors | Yao Li Wang, Gai Hong Dong, Chen Yang Li, Zhi Wei Wu, Jing Sun |
| Keywords | Creep Rupture Life, IMC, RE, Sn2.5Ag0.7Cu Solder Alloy |
| Price | US$ 28,- |
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Abstract
Creep property is one of the most important factors to affect the reliability of soldered joints. The effect of rare earth(RE) on the creep rupture life of Sn2.5Ag0.7Cu solder joints were investigated under constant temperature and stress using creep specimens with a 1mm2 cross sectional area. The results show that adding tiny RE in Sn2.5Ag0.7Cu solder alloy can effectually affect the size and configuration of the intermetallic compound (IMC) of interfacial layer. The IMC of Sn2.5Ag0.7Cu interfacial layer is thinner and its thickness is homogeneous with adding 0.1% RE, and the creep rupture life of solder joints is longest, which is apparently superior to that of Sn2.5Ag0.7Cu and commercial used Sn3.8Ag0.7Cu solder alloy.
