Paper Title:
Cu Particles Deposition onto MWCNTs by Chemical Reaction
  Abstract

CNTs were decorated with Cu particles to decrease floatation of CNTs and improve the wettability between CNTs and Al melt by chemical reaction method. The as-received size of multi-wall CNTs with 99.5% purity was 10~20nm in diameter and 20um in length. Before Cu deposition, the purified CNTs were suspended in solvent solution and ultrasonically stirred to improve the dispersion of CNTs in the copper chloride solution. The metallic Zn and Zn/CNTs composite powders were added into the suspension to precipitate Cu onto the CNTs surface. The Cu deposited CNTs have been characterized in respect of dispersion and size changes of CNTs and Cu particles with field emission scanning electron microscopy(FESEM). The deposited Cu particles onto the CNTs surface were in the range of 100~300nm in diameter. Also, the application of high ultrasonic treatment improved the full coverage of CNTs surface with Cu nanoparticles. From this study, the multi-wall CNTs have been deposited and embedded with Cu particles by chemical reduction process.

  Info
Periodical
Edited by
Hyungsun Kim, Jian Feng Yang, Chuleol Hee Han, Somchai Thongtem and Soo Wohn Lee
Pages
211-214
DOI
10.4028/www.scientific.net/MSF.695.211
Citation
G. S. Cho, J. K. Lim, H. Jang, K. H. Choe, W. S. Lee, "Cu Particles Deposition onto MWCNTs by Chemical Reaction", Materials Science Forum, Vol. 695, pp. 211-214, 2011
Online since
July 2011
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Price
$32.00
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