Paper Title:
Preparation of the Multi-Layer Copper and Nickel Foam by Electrodeposition
  Abstract

The multi-layer copper/nickel foam was prepared by the electrodeposition methods adopted the polyurethane as frame foundation. The foam is provided with a three-dimension grid structure and porosity of 96%-98%. The morphology of foam was examined by scanning electron microscope in synthesis procedure. The main physical characteristics of multi-layer copper/nickel foam were determined. Its apparent density and pore size are 190-210 kg/m3 and 1.4-1.7 mm respectively.

  Info
Periodical
Edited by
Hyungsun Kim, Jian Feng Yang, Chuleol Hee Han, Somchai Thongtem and Soo Wohn Lee
Pages
557-560
DOI
10.4028/www.scientific.net/MSF.695.557
Citation
Q. L. Zhang, X. Cheng, X. Z. Lan, X. Y. Hu, "Preparation of the Multi-Layer Copper and Nickel Foam by Electrodeposition", Materials Science Forum, Vol. 695, pp. 557-560, 2011
Online since
July 2011
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Price
$32.00
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