Paper Title:
Thermal Analysis of Dedicated Computer Based on ANSYS
  Abstract

After creating the three-dimensional models of dedicated computer, models can be smoothly put into ANSYS through interface between Pro/E and ANSYS. By selecting the grid cells, setting parameters of material properties, dividing grids, applying load and boundary conditions and post-processing, the temperature contours of the whole case and its key components are got. Compared with the test results, it was verified that the feasibility and rationality of carrying out thermal simulation by ANSYS software, providing a theoretical basis for the designers to optimize dedicated computer case.

  Info
Periodical
Materials Science Forum (Volumes 697-698)
Chapter
I. Advanced Manufacturing Technology and Equipment
Edited by
Tian Huang, Dawei Zhang, Bin Lin, Anping Xu, Yanling Tian and Weiguo Gao
Pages
277-281
DOI
10.4028/www.scientific.net/MSF.697-698.277
Citation
Y.R. Zhang, L. Gao, S.J. Li, H.X. Bi, "Thermal Analysis of Dedicated Computer Based on ANSYS", Materials Science Forum, Vols. 697-698, pp. 277-281, 2012
Online since
September 2011
Export
Price
$32.00
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