Paper Title:
The Dissolution Mechanism of Copper Weld Brazing with Cu-Based Brazing Alloys
  Abstract

In this paper, the dissolution mechanism of copper weld brazing has been researched. The thickness losses of Cu foil in contact with molten Cu-P and Cu-Ag binary alloys at different temperatures have been studied. And the dissolution rate constants in both alloys is calculated and exists following relation: kCu-P (T)=10kCu-Ag (T), which explains the special phenomenon that the dissolving amount of copper in Cu-P liquid alloys is larger than that in Cu-Ag liquid alloys by using weld brazing technology. The dissolution rate of copper in filler metals is the main reason to realize weld brazing. It can be concluded that element P is indispensable in filler metals as the function of accelerating dissolution during weld brazing.

  Info
Periodical
Materials Science Forum (Volumes 697-698)
Chapter
II. Material Forming Science and Technology
Edited by
Tian Huang, Dawei Zhang, Bin Lin, Anping Xu, Yanling Tian and Weiguo Gao
Pages
394-398
DOI
10.4028/www.scientific.net/MSF.697-698.394
Citation
Y. N. Li, Z.L. Peng, J.C. Yan, "The Dissolution Mechanism of Copper Weld Brazing with Cu-Based Brazing Alloys", Materials Science Forum, Vols. 697-698, pp. 394-398, 2012
Online since
September 2011
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Price
$32.00
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