Paper Title:

Ultrafine Grained Microstructure in Al-Cu-Si Alloy Obtained by Accumulative Roll Bonding Process

Periodical Materials Science Forum (Volumes 702 - 703)
Main Theme Textures of Materials - ICOTOM 16
Edited by Asim Tewari, Satyam Suwas, Dinesh Srivastava, Indradev Samajdar and Arunansu Haldar
Pages 157-160
DOI 10.4028/www.scientific.net/MSF.702-703.157
Citation Wahdat Ullah et al., 2011, Materials Science Forum, 702-703, 157
Online since December, 2011
Authors Wahdat Ullah, Gouthama
Keywords Accumulative Roll Bonding (ARB), Dynamic Recrystallization (DRX), Role of Precipitates, UFG Materials
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Abstract

An Ultrafine grain (UFG) microstructure is developed on the sheet of Al-2.4wt%Cu-0.3wt%Si alloy after three passes of accumulative roll bonding (ARB) process. The detailed of the microstructural features and phases at different strain condition has been studied by transmission electron microscopy (TEM). Observation indicates at the possibility of dynamic recovery and recrystallisation during the ARB processing itself. The material becomes ultrafine grains after three passes of ARB itself with the formation of dynamically recrystallised grains all over the sample. TEM evidence is presented in support of this proposal.