Paper Title:
Experimental Investigation of Texture Gradients in Aluminium/Copper Plates Bonded through Explosive Welding Process
  Abstract

In this study, the commercial purity Al/Cu plates were bonded through the explosive welding process. The SEM/EBSD local orientation measurements were conducted to consider the changes in the microstructure and the development of texture gradients for the applied explosive loading. A particular attention was paid to the texture changes across the interface. The detailed local orientation measurements show that the ultra-fine grained layers are formed close to the bonding zone. The layers were characterized by the copper-type rolling texture components. The interface was outlined by a characteristic sharp transition between the two materials. However, in some places, local melted zones were also encountered, mainly in the front slope of the waves.

  Info
Periodical
Materials Science Forum (Volumes 702-703)
Chapter
Chapter 5: Annealing
Edited by
Asim Tewari, Satyam Suwas, Dinesh Srivastava, Indradev Samajdar and Arunansu Haldar
Pages
603-606
DOI
10.4028/www.scientific.net/MSF.702-703.603
Citation
H. Paul, M. Miszczyk, M. Prażmowski, "Experimental Investigation of Texture Gradients in Aluminium/Copper Plates Bonded through Explosive Welding Process", Materials Science Forum, Vols. 702-703, pp. 603-606, 2012
Online since
December 2011
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Price
$32.00
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