The Morphology and Evolution of Cu6Sn5 at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging
| Periodical | Materials Science Forum (Volumes 704 - 705) |
|---|---|
| Main Theme | Physical and Numerical Simulation of Material Processing VI |
| Edited by | Jitai Niu and Guangtao Zhou |
| Pages | 685-689 |
| DOI | 10.4028/www.scientific.net/MSF.704-705.685 |
| Citation | Yao Li Wang et al., 2011, Materials Science Forum, 704-705, 685 |
| Online since | December, 2011 |
| Authors | Yao Li Wang, Ke Ke Zhang, Chen Yang Li, Li Juan Han |
| Keywords | Aging, Cu6Sn5, Morphology, Sn-2.5Ag-0.7Cu-0.1RE Solder Alloy |
| Price | US$ 28,- |
The morphology and growing behavior of Cu6Sn5 intermetallic compound (IMC) of low Ag content Sn-2.5Ag-0.7Cu-0.1RE/Cu solder joint interface are investigated by adopting the X-ray diffraction, JSM-5610LV scanning electronic microscope and energy spectrum analysis. The results show that the cross-section morphology Cu6Sn5 of the solder joint interface is scallop-like and its section morphology is circle-like grain. With the aging time increasing, the cross-section Cu6Sn5 morphology of the solder joint interface can be changed from the scallop-like to the shape-layer, and the growing kinetics is coincidence with the law of parabola and its growing behavior is controlled by diffusion. With adding a small amount of rare earth elements in the Sn-2.5Ag-0.7Cu solder alloy, the growing rate of the Cu6Sn5 can be reduced.
