Paper Title:

Density of Etch Pits on C-Face 4H-SiC Surface Produced by ClF3 Gas

Periodical Materials Science Forum (Volume 725)
Main Theme Defects-Recognition, Imaging and Physics in Semiconductors XIV
Edited by Hiroshi Yamada-Kaneta and Akira Sakai
Pages 49-52
DOI 10.4028/www.scientific.net/MSF.725.49
Citation Hitoshi Habuka et al., 2012, Materials Science Forum, 725, 49
Online since July, 2012
Authors Hitoshi Habuka, Kazuchika Furukawa, Toshimitsu Kanai, Tomohisa Kato
Keywords 4H-SiC, C-Face, Chlorine Trifluoride Gas, Etch Pit
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Abstract

The etch pits on the C-face 4H-SiC substrate was produced by chlorine trifluoride gas at various temperatures. The etch pit density showed the comparable value to the current dislocation density level of the Si-face 4H-SiC, when the etching was performed around 713 K. Thus, the etch pit density obtained by this technique is expected to reveal the crystal quality.