Paper Title:
Reorientation of Stress Induced Alignment of Thermal Donors in Silicon
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 83-87)
Edited by
Gordon Davies, G.G. DeLeo and M. Stavola
Pages
401-406
DOI
10.4028/www.scientific.net/MSF.83-87.401
Citation
P. Wagner, J. Hage, J.M. Trombetta, G.D. Watkins, "Reorientation of Stress Induced Alignment of Thermal Donors in Silicon", Materials Science Forum, Vols. 83-87, pp. 401-406, 1992
Online since
January 1992
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Price
$32.00
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