|Authors / Editors:||D.D.L. Chung|
|TOC:||Table of contents|
Composite materials are traditionally designed for the mechanical properties, due to their structural applications. However, composite materials are increasingly used in non-structural applications, such as electronic packaging and thermal management. Moreover, structural composite materials that are multifunctional are increasingly needed, due to the demand of smart structures and the importance of weight saving. As a consequence, structural materials that can provide electronic functions are needed. Thus, electronic functions are desirable for both non-structural and structural composite materials.
This book covers the science and engineering of composite materials for electronic functions. The composites include those with polymer, metal, cement and carbon matrices. The electronic functions are derived from the electrical, electromagnetic and thermal properties of the composites.
Review from Ringgold Inc., ProtoView: Explains the science and engineering of non-structural and structural composite materials for electronic functions derived from the electrical, electromagnetic, and thermal properties of composites. Emphasis is on non-structural composites for electronic packaging and structural composites for smart structures. Composites covered include those with polymer, metal, cement, and carbon matrices. Lacks a subject index. The author is affiliated with the Composite Materials Research Laboratory at the State University of New York-Buffalo.