Papers by keyword «Microstructure» and «Copper (Cu)»
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Microstructure and Mechanical Behavior of Cu-Based Composites Reinforced with WC and TiC Particles, Prepared by Spray Forming
Authors: A. Zúñiga, R. Palma, A. Sepúlveda O., T. Löbel, L. Núñez
Keywords: Carbide, Composite, Copper (Cu), Fracture, Mechanical Property, Microstructure, Spray Forming, Strengthening
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Texture Formation with Different Rolling Modes in Copper
Authors: Jan Pospiech, M. Wróbel, Jan Bonarski, M. Blicharski
Keywords: Copper (Cu), Microstructure, Rolling, Texture, Transverse Rolling
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The Effect of Substrate Texture and Electroplating Conditions on the Texture and Surface Morphology of Copper Electrodeposits
Authors: Jae Young Cho, Jerzy A. Szpunar
Keywords: Atomic Force Microscopy (AFM), Copper (Cu), Electroplating, Microstructure, Morphology, Orientation Image Microscopy (OIM), Texture, X-Ray
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The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films
Authors: Young Chang Joo, Soo Jung Hwang, Hyun Park
Keywords: Copper (Cu), Diffusion, Electroplating, Microstructure, Sputtering, Stress Voiding, Thin Film
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Development of an AZ91A/Cu Hybrid Composite with Improved Mechanical Properties Using the Novel Technique of Disintegrated Melt Deposition
Authors: K.F. Ho, Manoj Gupta
Keywords: AZ91 Alloy, Composite, Copper (Cu), Mechanical Property, Microstructure
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Graded Microstructure at Fiber / Copper Matrix Interface in FRM Fabricated by the Reaction at Narrow Holes Method
Authors: Yasuhiko Tanaka, Takeshi Goto, Yoshimi Watanabe
Keywords: Aluminium, Composite, Copper (Cu), Fiber, Fiber Reinforced Metal FRM, Hardness, Intermetallic Compounds, Microstructure
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Texture Gradient in ECAP Copper Measured by Synchrotron Radiation
Authors: Werner Skrotzki, N. Scheerbaum, C.-G. Oertel, Heinz Günter Brokmeier, Satyam Suwas, László S. Tóth
Keywords: Copper (Cu), Equal Channel Angular Pressing (ECAP), Microstructure, Synchrotron Radiation, Texture
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Equal Channel Extrusion Heterogeneities in Recrystallized Copper
Authors: C.T. Necker, D.J. Alexander, Irene J. Beyerlein
Keywords: Copper (Cu), Equal Channel Angular Extrusion (ECAE), Heterogeneity, Microstructure, Recrystallization, Texture
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Heterogeneity and Anisotropy in Microstructure and Mechanical Properties of Pure Copper Processed by Equal Channel Angular Pressing
Authors: Jing Tao Wang, Zhong Ze Du, Feng Kang, Guang Chen
Keywords: Anisotropy, Copper (Cu), Equal Channel Angular Pressing (ECAP), Heterogeneity, Mechanical Property, Microstructure
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Structure and Mechanical Properties of Submicrocrystalline Copper Produced by ECAP to Very High Strains
Authors: Alexei Vinogradov, T. Suzuki, Satoshi Hashimoto, Kazuo Kitagawa, A.A. Kuznetsov, Sergey Dobatkin
Keywords: Copper (Cu), Electron Backscattered Diffraction (EBSD), Equal Channel Angular Pressing (ECAP), Mechanical Property, Microstructure, Thermal Stability
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