Papers by keyword «Residual Stress» and «Copper (Cu)»
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X-Ray Diffraction Determination of Residual Stresses in Narrow Copper Interconnects with Submicronic Widths
Authors: O. Sicardy, I. Touet, L. Arnaud, F. Charlet, T. Berger
Keywords: Copper (Cu), Elasticity, Microelectronics, Residual Stress, X-Ray Diffraction (XRD)
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Effect of Plating Condition on the Mechanical Properties and Residual Stress of Electroplated Copper Film
Authors: Yoo Min Ahn, Yong Jun Ko, Hyun Joon Kim, Dong Ho Lee, Su Kei Lee, Jae Ho Lee
Keywords: Additive, CMP Dishing, Copper (Cu), Current Type, Electroplating, Residual Stress, ULSI
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